Title:
MANUFACTURING METHOD AND MANUFACTURING APPARATUS FOR SUBSTRATE WITH POSITIONING HOLE, AND A PLURALITY OF SUBSTRATES EACH WITH POSITIONING HOLE
Document Type and Number:
WIPO Patent Application WO/2015/166543
Kind Code:
A1
Abstract:
[Problem] To provide a manufacturing method and a manufacturing apparatus for a substrate with a positioning hole which enables higher positional accuracy of an electronic component mounted on the substrate, and a plurality of substrates each with a positioning hole.
[Solution] The present invention comprises a base (10), an image sensor (11), a computation device (12), and a drilling positioning device (13). The image sensor (11) detects the reference position of an electronic component mounted on a substrate. The computation device (12) finds a position for a positioning hole by computation on the basis of the reference position detected by the image sensor (11). The drilling positioning device (13) has a substrate setting table (31), a substrate retainer (32), and a drilling unit (33). On the basis of positional coordinates for the positioning hole, which are obtained by computing the correction amount of a mounting error (XYθ) of the substrate (2) by the computation device (12), the substrate setting table (31) can change an XYθ position. The drilling unit (33) forms the positioning hole in the position found by the computation device (12) within the substrate by moving the substrate setting table (31).
Inventors:
ITO HARUMI (JP)
NAKAMURA HIDEAKI (JP)
NAKAMURA TAKASHI (JP)
NAKAMURA HIDEAKI (JP)
NAKAMURA TAKASHI (JP)
Application Number:
PCT/JP2014/061915
Publication Date:
November 05, 2015
Filing Date:
April 28, 2014
Export Citation:
Assignee:
OTAKI ELECTRIC CO LTD (JP)
International Classes:
H05K1/02; H05K3/00
Foreign References:
| JP2012227325A | 2012-11-15 | |||
| JP2000082868A | 2000-03-21 | |||
| JP2012015131A | 2012-01-19 | |||
| JP2009135295A | 2009-06-18 |
Attorney, Agent or Firm:
SUDA Atsushi et al. (JP)
Atsushi Suda (JP)
Atsushi Suda (JP)
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