MANUFACTURING METHOD OF COMPONENT-INTERNAL SUBSTRATE

WIPO Patent Application WO/2013/129154

A1

This manufacturing method of a component-internal substrate involves a step in which a first resin layer (47) is prepared in which a first through-hole (42) is formed, a step in which a protrusion-forming layer (49) provided with an insertion hole (46) having multiple protrusions formed on the edge of the opening is laminated on the first resin layer (47), a step in which a chip-type electronic component is inserted inside of a cavity, said cavity being formed by the first through-hole (42) and the insertion hole (46) communicating in the direction of lamination of the first resin layer (47) and the protrusion-forming layer (49), and a step in which, after insertion of the chip-type electronic component, a laminate body is obtained by heating the resin layers including the first resin layer (47) and the protrusion-forming layer (49) and integrating the first resin layer (47) and the protrusion-forming layer (49). The insertion hole (46) is formed so as to have an edge body (22) which extends so as to connect the protrusions, and protrusions (21) which protrude from the edge body (22) so as to reduce the opening area of the edge body (22), and the formation region of the opening of the first through-hole (42) is larger than the region surrounded by the edge body (22).

WO/2004/093153	NON-HOMOGENEOUS MULTILAYER CIRCUIT ASSEMBLIES AND METHOD OF MANUFACTURE
JP2006270079	WIRING BOARD AND METHOD OF MANUFACTURING SAME

YOSHIOKA TORU (JP)

PCT/JP2013/053834

September 06, 2013

February 18, 2013

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MURATA MANUFACTURING CO (JP)

H05K3/46

JP2006073763A	2006-03-16
JP2008147254A	2008-06-26
JP2009246315A	2009-10-22

Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)

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