Title:
MANUFACTURING METHOD FOR GLASS-EMBEDDED SILICON SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2011/118787
Kind Code:
A1
Abstract:
The disclosed manufacturing method for a glass-embedded silicon substrate enables the rapid embedding of glass and suppresses voids. Concave sections (52) are formed on the main surface of a silicon substrate main body (51). A first main surface of a glass substrate (54) is superimposed on the main surface of the silicon substrate main body (51). The glass substrate (54) is softened by applying heat thereto, and part of the glass substrate (54) is embedded in the concave sections (52) of the silicon substrate main body (51). The glass substrate (54) is cooled. The part of the glass substrate (54) embedded in the concave sections (52) of the silicon substrate main body (51) is left behind, and the other part is removed. When the part of the glass substrate (54) is embedded in the concave sections (52) of the silicon substrate main body (51), through holes (53) are formed which connect the inner section and the outer section of the concave sections (52).
Inventors:
TOMOIDA RYO (JP)
NAKATANI TOMOHIRO (JP)
TAURA TAKUMI (JP)
OKUMURA SHIN (JP)
NAKATANI TOMOHIRO (JP)
TAURA TAKUMI (JP)
OKUMURA SHIN (JP)
Application Number:
PCT/JP2011/057402
Publication Date:
September 29, 2011
Filing Date:
March 25, 2011
Export Citation:
Assignee:
PANASONIC ELEC WORKS CO LTD (JP)
TOMOIDA RYO (JP)
NAKATANI TOMOHIRO (JP)
TAURA TAKUMI (JP)
OKUMURA SHIN (JP)
TOMOIDA RYO (JP)
NAKATANI TOMOHIRO (JP)
TAURA TAKUMI (JP)
OKUMURA SHIN (JP)
International Classes:
H01L29/84; G01P15/08; G01P15/125; H01L23/14; H01L23/15
Foreign References:
| JP2001144398A | 2001-05-25 | |||
| JP2006047279A | 2006-02-16 |
Attorney, Agent or Firm:
TANAKA, Mitsuo et al. (JP)
Mitsuo Tanaka (JP)
Mitsuo Tanaka (JP)
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Claims: