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Title:
MANUFACTURING METHOD FOR GLASS-EMBEDDED SILICON SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2011/118787
Kind Code:
A1
Abstract:
The disclosed manufacturing method for a glass-embedded silicon substrate enables the rapid embedding of glass and suppresses voids. Concave sections (52) are formed on the main surface of a silicon substrate main body (51). A first main surface of a glass substrate (54) is superimposed on the main surface of the silicon substrate main body (51). The glass substrate (54) is softened by applying heat thereto, and part of the glass substrate (54) is embedded in the concave sections (52) of the silicon substrate main body (51). The glass substrate (54) is cooled. The part of the glass substrate (54) embedded in the concave sections (52) of the silicon substrate main body (51) is left behind, and the other part is removed. When the part of the glass substrate (54) is embedded in the concave sections (52) of the silicon substrate main body (51), through holes (53) are formed which connect the inner section and the outer section of the concave sections (52).

Inventors:
TOMOIDA, Ryo (1048, Oaza-Kadoma, Kadoma-sh, Osaka 86, 〒5718686, JP)
友井田 亮 (〒86 大阪府門真市大字門真1048番地 パナソニック電工株式会社内 Osaka, 〒5718686, JP)
NAKATANI, Tomohiro (1048, Oaza-Kadoma, Kadoma-sh, Osaka 86, 〒5718686, JP)
中谷 友洋 (〒86 大阪府門真市大字門真1048番地 パナソニック電工株式会社内 Osaka, 〒5718686, JP)
Application Number:
JP2011/057402
Publication Date:
September 29, 2011
Filing Date:
March 25, 2011
Export Citation:
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Assignee:
PANASONIC ELECTRIC WORKS CO., LTD. (1048, Oaza-Kadoma Kadoma-sh, Osaka 86, 〒5718686, JP)
パナソニック電工株式会社 (〒86 大阪府門真市大字門真1048番地 Osaka, 〒5718686, JP)
TOMOIDA, Ryo (1048, Oaza-Kadoma, Kadoma-sh, Osaka 86, 〒5718686, JP)
友井田 亮 (〒86 大阪府門真市大字門真1048番地 パナソニック電工株式会社内 Osaka, 〒5718686, JP)
NAKATANI, Tomohiro (1048, Oaza-Kadoma, Kadoma-sh, Osaka 86, 〒5718686, JP)
International Classes:
H01L29/84; G01P15/08; G01P15/125; H01L23/14; H01L23/15
Foreign References:
JP2001144398A
JP2006047279A
Attorney, Agent or Firm:
TANAKA, Mitsuo et al. (AOYAMA & PARTNERS, IMP Building 3-7, Shiromi 1-chome, Chuo-ku, Osaka-sh, Osaka 01, 〒5400001, JP)
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Claims: