MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

Title:

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2017/060970

Kind Code:

A1

Abstract:

The purpose of the present invention is to provide a technique by which it is possible to reduce the number of parts and to reduce cost. In the present invention , a structure provided with a semiconductor element 13, a plurality of electrode terminals 32, and a dam bar 33 that connects the plurality of electrode terminals 32 is prepared, and a portion 36 of the structure including some of the plurality of electrode terminals 32 and the dam bar 33 is disposed in a terminal hole 42c. In the terminal hole 42c, the portion 36 of the structure is held on both sides by a movable clamp 71, and at least a portion of the movable clamp 71 is fitted into the terminal hole 42c, after which, a resin 73 is injected into the interior space of a pair of molds.

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Inventors:

UEDA TETSUYA (JP)
YOSHIDA HIROSHI (JP)
OKA SEIJI (JP)
SAKAMOTO KEN (JP)

Application Number:

PCT/JP2015/078293

Publication Date:

April 13, 2017

Filing Date:

October 06, 2015

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP (JP)

International Classes:

H01L21/56; H01L23/48; H01L23/50

Foreign References:

JPH10116962A	1998-05-06
JPH01110446U	1989-07-26
JP2003017643A	2003-01-17
JPS63302545A	1988-12-09
JPH01157445U	1989-10-30
JP2010182879A	2010-08-19
JPH10223825A	1998-08-21
JP2008243970A	2008-10-09