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Patent Searching and Data


Title:
MANUFACTURING METHOD FOR WPC BOARD AND FLATTENING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/124377
Kind Code:
A1
Abstract:
A WPC board manufacturing method comprises: a compound generating step of generating compounds formed by mixing natural wood and a plastic resin; a flattening step of flattening a compound group in which the compounds generated in the compound generation step are accumulated such that the compound group has a predetermined height; and a shaping step of pressing the compound group, which has been flattened in the flattening step, through a belt press to shape the compound group into a board.

Inventors:
SON DAL HO (KR)
Application Number:
PCT/KR2017/001538
Publication Date:
July 05, 2018
Filing Date:
February 13, 2017
Export Citation:
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Assignee:
KYUNGDONG WORLDWIDE CO LTD (KR)
International Classes:
B29C43/24; B29B7/88; B29C43/00; B29C43/48; B29K511/14
Foreign References:
KR20090098260A2009-09-17
KR101226455B12013-01-28
JP2002316714A2002-10-31
KR101283502B12013-08-19
KR20160046590A2016-04-29
Attorney, Agent or Firm:
BAE, KIM & LEE IP GROUP (KR)
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