Title:
MANUFACTURING MONITORING ASSISTANCE DEVICE, MANUFACTURING MONITORING ASSISTANCE METHOD, AND MANUFACTURING MONITORING ASSISTANCE PROGRAM
Document Type and Number:
WIPO Patent Application WO/2020/166346
Kind Code:
A1
Abstract:
This manufacturing monitoring assistance device (1) is characterized by comprising: a model-creating unit (21) that creates a computation model of when the product is normal on the basis of the three dimensional shape acquired from a sample of the product; a simulation unit (22) that creates a modified computation model when the product is abnormal by adding a sample of the abnormal portion of the product to the created computation model, and performs simulation on the computation model and the modified computation model; and a monitoring method determining unit (23) that determines a method for monitoring the product manufacturing process on the basis of the abnormality index, which is the difference between sensor output that is the result of the simulation performed on the computation model, and the sensor output that is the result of simulation performed on the modified computation model, and displays on an output device the determined method and the abnormality index.
Inventors:
KITAOKA MASANORI (JP)
ENDOU HISASHI (JP)
KAKENO NOBUHIRO (JP)
YOSHIKAWA HIROSHI (JP)
YAMADA TOSHIHIRO (JP)
ENDOU HISASHI (JP)
KAKENO NOBUHIRO (JP)
YOSHIKAWA HIROSHI (JP)
YAMADA TOSHIHIRO (JP)
Application Number:
PCT/JP2020/003328
Publication Date:
August 20, 2020
Filing Date:
January 30, 2020
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
G05B19/418; G05B23/02
Domestic Patent References:
| WO2015008373A1 | 2015-01-22 |
Foreign References:
| JP2018049390A | 2018-03-29 | |||
| JP2009080514A | 2009-04-16 | |||
| JP2006346180A | 2006-12-28 |
Attorney, Agent or Firm:
ISONO INTERNATIONAL PATENT OFFICE, P.C. (JP)
Download PDF: