Title:
MAT AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2012/147422
Kind Code:
A1
Abstract:
Provided is a suitably firm and lightweight mat having excellent thermal insulation properties, flame resistance, and sound absorbency. Besides, it is possible to use disposed materials for the mat. A ground product of resin foam (15), consisting of a moisture curing isocyanate compound adhering to a ground product of resin foam containing 10 wt% or more of a ground product of melamine resin foam, is placed in a metal mold (70). By curing the moisture curing isocyanate compound adhering to the ground product of resin foam with moisture, the ground product of resin foam is bonded to form a mat (11) with a density of 23-110 kg/m3 inclusive.
Inventors:
NAKAO HIROSHI
ITAKURA ATSUHIKO
ITAKURA ATSUHIKO
Application Number:
PCT/JP2012/056245
Publication Date:
November 01, 2012
Filing Date:
March 12, 2012
Export Citation:
Assignee:
INOUE MTP KK (JP)
NAKAO HIROSHI
ITAKURA ATSUHIKO
NAKAO HIROSHI
ITAKURA ATSUHIKO
International Classes:
A47G27/02; B60R13/01; B60R13/02; B60N3/04
Foreign References:
| JPH09125040A | 1997-05-13 | |||
| JP2008525289A | 2008-07-17 | |||
| JP2000052836A | 2000-02-22 | |||
| JPH09202169A | 1997-08-05 | |||
| JP2003063319A | 2003-03-05 | |||
| JP2005008714A | 2005-01-13 | |||
| JPS55142628A | 1980-11-07 | |||
| JPS56152848A | 1981-11-26 |
Other References:
See also references of EP 2702906A4
Attorney, Agent or Firm:
Shin-Ei Patent Firm, P. C. (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
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Claims: