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Title:
MATERIAL FOR CONTACT AND CONTAINING AG ALLOY AS MAIN COMPONENT, CONTACT USING SAID MATERIAL FOR CONTACT, AND ELECTRICAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/241854
Kind Code:
A1
Abstract:
Provided is a material that is for a contact and that is likely to avoid damage to the contact caused by arcing occurring during opening and closing of the contact. This material for a contact contains a Ag alloy as a main component. The material contains a Ag alloy and at least one main additive that is present as a phase different from that of the Ag alloy and is selected from the group consisting of tin oxide, nickel, nickel oxide, iron, iron oxide, tungsten, tungsten carbide, tungsten oxide, zinc oxide, and carbon. The Ag alloy contains, in a range not less than 0.01 wt% but not more than a solid solution limit to Ag, a solid solution element having a hole-binding energy lower than a hole-binding energy which is a binding energy between a hole in the metal Ag and a metal atom contained in the main additive or carbon if the main additive is carbon.

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Inventors:
TANAKA JUNICHI (JP)
MISUMI SHUICHI (JP)
MORI TETSUYA (JP)
Application Number:
PCT/JP2020/021427
Publication Date:
December 03, 2020
Filing Date:
May 29, 2020
Export Citation:
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Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
C22C5/06; C22C1/04; C22C32/00
Foreign References:
JPH06136472A1994-05-17
JPH0257649A1990-02-27
JP2015125936A2015-07-06
JPH03215638A1991-09-20
JP2015125935A2015-07-06
CN108411135A2018-08-17
KR20110054625A2011-05-25
JPH09171735A1997-06-30
JPS53149667A1978-12-27
Other References:
CHUN YU ET AL.: "First principles calculation of the effects of solute atom on electromigration resistance of Al interconnects", J. PHYSICS D:APPL. PHYS, vol. 42, 2009, pages 125501, XP020158405
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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