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Patent Searching and Data


Title:
MATERIAL FOR PATTERN FORMATION, APPARATUS FOR PATTERN FORMATION, AND METHOD FOR PATTERN FORMATION
Document Type and Number:
WIPO Patent Application WO/2006/129564
Kind Code:
A1
Abstract:
This invention provides a material for pattern formation, which, when a highly transparent material is used as a support for the formation of a pattern like a solder resist, can realize a good resist face shape, a higher-definition pattern, and a suitable blue or green color, and an apparatus for pattern formation, comprising the material for pattern formation, and a method for pattern formation using the material for pattern formation. The material for pattern formation is characterized in that the material comprises a support and a photosensitive layer provided on the support, the photosensitive layer is formed of a photosensitive composition comprising a binder, a filler, a polymerizable compound, a heat crosslinking agent, a photopolymerization initiator, and a colorant, the thickness of the photosensitive layer in its part to be exposed remains unchanged after the exposure and development, the minimum energy of light used in the exposure is 0.1 to 200 mJ/cm2, the haze value of the photosensitive layer at the exposure wavelength is 0.1 to 40%, and the pattern formed through the exposure and development is blue to green.

Inventors:
IKEDA KIMI (JP)
KAMIKAWA HIROSHI (JP)
Application Number:
PCT/JP2006/310545
Publication Date:
December 07, 2006
Filing Date:
May 26, 2006
Export Citation:
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Assignee:
FUJI PHOTO FILM CO LTD (JP)
IKEDA KIMI (JP)
KAMIKAWA HIROSHI (JP)
International Classes:
G03F7/004; G03F7/027; G03F7/033
Foreign References:
JP2005122048A2005-05-12
JP2005043580A2005-02-17
JP2000144071A2000-05-26
JP2004020917A2004-01-22
JP2000181058A2000-06-30
JPH0815861A1996-01-19
Attorney, Agent or Firm:
Hirota, Koichi (NAGARE & ASSOCIATES 4th Floor, Shinjuku TR Building, 2-2-13, Yoyog, Shibuya-ku Tokyo 53, JP)
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