MATERIAL FOR SEMICONDUCTOR ELEMENT PROTECTION AND SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2016/010067

A1

Provided is a material for semiconductor element protection, which has excellent coatability and is capable of providing a cured product having excellent heat dissipation properties and flexibility, and which is capable of reliably protecting a semiconductor element. A material for semiconductor element protection according to the present invention is used for the purpose of forming a cured product on the surface of a semiconductor element by being applied over the surface of the semiconductor element in order to protect the semiconductor element. Different from a material that is arranged between a semiconductor element and another member to be connected and forms a cured product which bonds and affixes the semiconductor element and the another member to be connected such that the element and the member are not separated from each other, this material for semiconductor element protection contains a flexible epoxy compound, an epoxy compound other than the flexible epoxy compound, a curing agent that is in a liquid state at 23°C, a curing accelerator and an inorganic filler that is spherical and has a thermal conductivity of 10 W/m·K or more.

NISHIMURA TAKASHI (JP)
MAENAKA HIROSHI (JP)
KOBAYASHI YUUSUKE (JP)
NAKAMURA SHIGERU (JP)
AOYAMA TAKUJI (JP)
KIM CHIZURU (JP)

PCT/JP2015/070248

January 21, 2016

July 15, 2015

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SEKISUI CHEMICAL CO LTD (JP)

C08L63/00; C08G59/20; C08G59/62; C08K3/22; C08K3/28; C08K3/34; H01L21/60; H01L23/00; H01L23/29; H01L23/31

WO2009011383A1

2009-01-22

JP2012126762A	2012-07-05
JP2006232950A	2006-09-07

MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)

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