MEASURING SENSOR PACKAGE AND MEASURING SENSOR

Title:

MEASURING SENSOR PACKAGE AND MEASURING SENSOR

Document Type and Number:

WIPO Patent Application WO/2017/110291

Kind Code:

A1

Abstract:

The present invention relates to a measuring sensor package capable of performing highly accurate measurement by suppressing influence of noise, and a measuring sensor. A measuring sensor package 1 includes a base body 2, a cover body 3, and a grounding conductor layer 4. The base body 2 houses a light emitting element and a light receiving element, and includes a base body main body 20, a plurality of grounding via conductors 21, an annular grounding conductor layer 22, a signal wiring conductor 23, and an external connection terminal 24. The grounding via conductors 21 are via conductors connected to a grounding potential, and are disposed, in plan view, on the base body main body 20 portions outside of a first housing recessed section 20a and a second housing recessed section 20b.

Inventors:

OODE YASUSHI (JP)
ITO HIROKI (JP)
SUGIMOTO YOSHIMASA (JP)
NIINO NORITAKA (JP)
MATSUNAGA SHOGO (JP)
HAYASHI TAKUYA (JP)

Application Number:

PCT/JP2016/083435

Publication Date:

June 29, 2017

Filing Date:

November 10, 2016

Export Citation:

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Assignee:

KYOCERA CORP (JP)

International Classes:

A61B5/026; A61B5/02

Foreign References:

JPS5146596B2	1976-12-09
JP2001284488A	2001-10-12
JP2005260877A	2005-09-22
JP2004041482A	2004-02-12
JPS63194638A	1988-08-11

Other References: