MEMBER CONNECTION METHOD - HITACHI CHEMICAL CO LTD

Title:

MEMBER CONNECTION METHOD

Document Type and Number:

WIPO Patent Application WO/2019/082896

Kind Code:

A1

Abstract:

This member connection method includes: a printing step in which a coating film 8 for connection made of a copper paste is formed as a predetermined printing pattern 9 on a connection region 5 of each of members 2, 3; a lamination step for laminating each of the members 2, 3 through the coating film 8; and a sintering step for sintering the coating film 8 to form a copper sintered body 4 and connecting each of the members 2, 3 by the copper sintered body 4, wherein: in the printing step, a coating film formation region 10, in which the coating film 8 is formed, and a coating film non-formation region 20, in which the coating film 8 is not formed, are formed in the printing pattern 9; and the coating film formation region 10 is partitioned into a plurality of concentrically-shaped regions 12a-12c and a plurality of radially-shaped regions 13a, 13b by a plurality of line-shaped regions 21a-21c provided so as to connect each of points A-D spaced apart from each other in a peripheral section 6 of the connection region 5.

Inventors:

NEGISHI MOTOHIRO (JP)
NAKAKO HIDEO (JP)
KAWANA YUKI (JP)
ISHIKAWA DAI (JP)
SUGAMA CHIE (JP)
EJIRI YOSHINORI (JP)

Application Number:

PCT/JP2018/039372

Publication Date:

May 02, 2019

Filing Date:

October 23, 2018

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD (JP)

International Classes:

H01L21/52; B22F1/05; B22F1/107; B22F7/04; B22F7/08; B22F1/052; B22F1/102

Domestic Patent References:

WO2017043540A1

2017-03-16

Foreign References:

JPH07111275A	1995-04-25
JPS5665598A	1981-06-03
JP2007509495A	2007-04-12
JP2000022313A	2000-01-21
JP2012106328A	2012-06-07
JP2008244242A	2008-10-09

Other References: