Title:
MEMORY MODULE WITH OFFSET NOTCHES FOR IMPROVED INSERTION AND STABILITY AND MEMORY MODULE CONNECTOR
Document Type and Number:
WIPO Patent Application WO2000064010
Kind Code:
A9
Abstract:
A memory module with offset notches for improved insertion and a memory module connector for mating thereto. The connector housing includes an accommodating space for receiving a portion of the memory module printed circuit board (PCB). A first key is disposed within the accommodating space of the housing and is positioned between the first end and the center of the housing. A second key is further disposed within the accommodating space and is positioned between the second end of the housing and the center. A distance between the first key and the second key is greater than 40% of the length of the housing. Either the first, second, or both keys may extend from the accommodating space beyond a top plane defined by a top side of the accommodating space of the housing. The memory module comprises the PCB with a first notch positioned between the first end of the PCB and the center of the PCB. A second notch is positioned between the second end of the PCB and the center of the PCB. A distance between the first notch and the second notch is greater than 40% of the length of the PCB. The first notch may be farther from the first end of the PCB than from the center, and the second notch may be closer to the second end of the PCB than to the center.
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Inventors:
HASSANZADEH ALI
ODISHO VICTOR
ODISHO VICTOR
Application Number:
PCT/US2000/009283
Publication Date:
November 29, 2001
Filing Date:
April 06, 2000
Export Citation:
Assignee:
SUN MICROSYSTEMS INC (US)
International Classes:
H01R12/70; H01R24/00; H05K1/02; H05K1/11; H05K1/14; H05K7/14; (IPC1-7): H01R12/18
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