Title:
MEMS SILICON MICROPHONE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2016/161670
Kind Code:
A1
Abstract:
Disclosed are an MEMS silicon microphone and a manufacturing method therefor. By arranging a single crystal silicon vibrating diaphragm (2) above a multi-hole back plate silicon substrate (1), and separating same by a silicon dioxide layer (9) which is bonded with the multi-hole back plate silicon substrate (1) through a silicon-silicon bonding method, both of them form a capacitor structure of the microphone. In addition, the single crystal silicon vibrating diaphragm (2) has the advantages of low residual stress and good uniformity, and therefore, the sensitivity and the yield of the MEMS silicon microphone can be improved. The vibrating diaphragm (2) is provided with spring supports (7), bosses (8), micropores (11) and other structures, which can release the residual stress on the vibrating diaphragm (2) rapidly while avoiding the possibility of suction between the vibrating diaphragm (2) and the multi-hole back plate silicon substrate (1), further improving the yield and the reliability of the microphone. Therefore, the MEMS silicon microphone structure has features such as a simple production process, high sensitivity, low cost, good uniformity, and high reliability.
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Inventors:
MIAO JIANMIN (CN)
Application Number:
PCT/CN2015/077281
Publication Date:
October 13, 2016
Filing Date:
April 23, 2015
Export Citation:
Assignee:
MICROLINK SENSTECH SHANGHAI LTD (CN)
International Classes:
H04R31/00; H04R19/04
Foreign References:
| CN103139691A | 2013-06-05 | |||
| CN103607684A | 2014-02-26 | |||
| CN104378724A | 2015-02-25 | |||
| CN102065362A | 2011-05-18 |
Other References:
See also references of EP 3094112A4
Attorney, Agent or Firm:
SHANGHAI SHENXIN LAW FIRM (CN)
上海申新律师事务所 (CN)
上海申新律师事务所 (CN)
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