Title:
MEMS STRUCTURE AND ACCELERATION SENSOR
Document Type and Number:
WIPO Patent Application WO/2016/039034
Kind Code:
A1
Abstract:
Provided is an MEMS structure wherein detection accuracy is improved by reducing a capacitance change caused by warpage generated in a substrate due to temperature dependency. In a first sensor 21, a weight section 24 and a third fixed electrode 55 that is provided on the substrate 12 face each other in the Z direction orthogonal to the plane of a substrate 12, and constitute a capacitor. When a closed curve 61 connecting two anchors 41 to each other in a plan view of the substrate 12 is set, the third fixed electrode 55 has a portion inside of the closed curve 61 as a first electrode section 55A, and a portion provided outside of the closed curve as a second electrode section 55B. The first sensor 21 has a relationship wherein a capacitance change quantity between the first electrode section 55A and the weight section 24 is cancelled by a capacitance change quantity between the second electrode section 55B and the weight section 24, in the cases where the warpage of the substrate 12 is generated due to a temperature change.
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Inventors:
SUZUKI TOSHIHISA (JP)
Application Number:
PCT/JP2015/071624
Publication Date:
March 17, 2016
Filing Date:
July 30, 2015
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G01P15/125; B81B3/00; G01P15/08; G01P15/18; H01L29/84
Domestic Patent References:
WO2009125510A1 | 2009-10-15 |
Foreign References:
JP2014071097A | 2014-04-21 | |||
JP2010164564A | 2010-07-29 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
Mutsumi Sameshima (JP)
Mutsumi Sameshima (JP)
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