Title:
METAL BASE CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2016/125650
Kind Code:
A1
Abstract:
A metal base circuit substrate having a metal base substrate, a first circuit pattern, and a first insulating layer between the metal base substrate and the first circuit pattern. The first insulating layer covers the lower surface of the first circuit pattern facing the metal base substrate and at least a region, of the side surface of the first circuit pattern, that is adjacent to the aforementioned lower surface.
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Inventors:
MIZUNO KATSUMI (JP)
IKEDA DAIKI (JP)
IKEDA DAIKI (JP)
Application Number:
PCT/JP2016/052305
Publication Date:
August 11, 2016
Filing Date:
January 27, 2016
Export Citation:
Assignee:
NHK SPRING CO LTD (JP)
International Classes:
H05K1/05; H05K1/03; H05K3/20; H05K3/44
Domestic Patent References:
| WO2014007327A1 | 2014-01-09 |
Foreign References:
| JP2013254921A | 2013-12-19 | |||
| JPH09139580A | 1997-05-27 | |||
| JP2003023223A | 2003-01-24 |
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
Masatoshi Kurata (JP)
Masatoshi Kurata (JP)
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