COPPER BASE SUBSTRATE - MITSUBISHI MATERIALS CORP

Title:

COPPER BASE SUBSTRATE

Document Type and Number:

Japanese Patent JP2021163880

Kind Code:

A

Abstract:

To provide a metal base substrate which is excellent in reliability to a cooling-heating cycle when an electronic component is mounted thereon.SOLUTION: A copper base substrate has a copper substrate, an insulating layer and a circuit layer laminated in this order, in which the insulating layer has a ratio of a thickness (unit: μm) to an elastic modulus at 100°C (unit: GPa) of 50 or more, and the circuit layer has an elastic modulus at 100°C of 100 GPa or less.SELECTED DRAWING: Figure 1

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Inventors:

ISHIKAWA SHIRO
HARA SHINTARO

Application Number:

JP2020065163A

Publication Date:

October 11, 2021

Filing Date:

March 31, 2020

Export Citation:

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Assignee:

MITSUBISHI MATERIALS CORP

International Classes:

H01L23/14; H01L23/36; H05K1/05

Attorney, Agent or Firm:

Yasushi Matsunuma
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami

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