Title:
METAL COLLOIDAL SOLUTION COMPOSITION AND CONDUCTOR OR INK FOR FORMING SEMICONDUCTOR PATTERN COMPRISING IT AND METHOD FOR FORMING CONDUCTOR OR SEMICONDUCTOR PATTERN
Document Type and Number:
WIPO Patent Application WO/2002/018080
Kind Code:
A1
Abstract:
A conductor or a semiconductor pattern formed on a semiconductive or nonconductive substrate by ejecting a solution, serving as a precursor of a conductor or a semiconductor and comprising a metal or composite metal oxide colloid produced by bonding a polymer compound having a function group exhibiting high physical or chemical adsorption to a metal or a metal oxide, as a protective agent, to one terminal or both terminals of a block copolymer comprising a hydrophilic block and a hydrophobic block, a compound curable upon irradiation with light, heat or electron beam energy, and a solvent, onto the surface of the substrate in a desired pattern by means of an ejector which can control ejection of an ink jet printer delicately and then irradiating a part of the substrate coated with the solution with light, heat or electron beam energy thereby hardening that part.
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Inventors:
KATAOKA KAZUNORI (JP)
NAGASAKI YUKIO (JP)
SAKURA TAKESHI (JP)
NAGASAKI YUKIO (JP)
SAKURA TAKESHI (JP)
Application Number:
PCT/JP2001/006655
Publication Date:
March 07, 2002
Filing Date:
August 02, 2001
Export Citation:
Assignee:
UPEPO & MAJI INC (JP)
KATAOKA KAZUNORI (JP)
NAGASAKI YUKIO (JP)
SAKURA TAKESHI (JP)
KATAOKA KAZUNORI (JP)
NAGASAKI YUKIO (JP)
SAKURA TAKESHI (JP)
International Classes:
B22F1/0545; C09K11/08; H01L21/288; H05K3/10; H05K3/12; (IPC1-7): B22F9/00
Foreign References:
| JP2000160210A | 2000-06-13 | |||
| EP0858854A1 | 1998-08-19 |
Other References:
WUELFING W.P. ET AL., J. AM. CHEM. SOC., vol. 120, no. 48, 1998, pages 12696 - 12697, XP002947511
Attorney, Agent or Firm:
Yanagino, Takao (15-5 Miyahara 1-chom, Yodogawa-ku Osaka-shi Osaka, JP)
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