Title:
METAL-FILLED MICROSTRUCTURE, PRODUCTION METHOD FOR METAL-FILLED MICROSTRUCTURE, AND STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/171808
Kind Code:
A1
Abstract:
Provided are: a metal-filled microstructure that suppresses defects in the filling of a plurality of pores with metal as well as defects in the structure of conductors formed from the metal; a production method for the metal-filled microstructure; and a structure. The metal-filled microstructure includes an insulating film and a plurality of needle-shaped conductors that are provided so as to pass through the insulating film in the thickness direction. The plurality of conductors each have a body part, a first region part that is provided at at least one tip of the conductor, and a second region part that is provided between the body part and the first region part. The first region part includes a first metal, the second region part includes a second metal, and the body part includes a third metal. The first region part includes more of the first metal than the second region part, and the first metal has a greater ionization tendency than the second metal.
Inventors:
KASUYA YUICHI (JP)
Application Number:
PCT/JP2021/000775
Publication Date:
September 02, 2021
Filing Date:
January 13, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C25D1/00; C25D5/02; C25D5/10; C25D5/12; C25D5/44; C25D7/00; C25D11/20; C25D11/24; H01B5/16; H01R11/01
Domestic Patent References:
| WO2017057150A1 | 2017-04-06 |
Foreign References:
| JP2012224944A | 2012-11-15 | |||
| JP2019149448A | 2019-09-05 | |||
| JPH06334087A | 1994-12-02 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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