Title:
METAL FILM FORMING COMPOSITION AND METAL FILM FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/135330
Kind Code:
A1
Abstract:
Provided is a metal film forming composition comprising: a metal complex represented by general formula (1), general formula (2), or general formula (3); a counter anion of the metal complex; and a solvent of the metal complex. In general formulae (1)-(3), M1 and M3 each independently represent, a metal atom selected from a group consisting of Ag, Cu, Li, Ni, Mn, Zn, and Co, and M3 represents a metal atom selected from a group consisting of Cu, Ni, Mn, and Co. L11-L32 each independently represent, an NH3 ligand, an R1NH2 ligand,an OH2 ligand, or a diamine-derived ligand, and R1 represents an alkylene group. 1n, 1m, 3n, and 3m each independently represent, an integer of 0-8; 2n and 2m each independently represent, an integer of 0-4; 1n+1m is in the range of 4-8; 2n+2m is in the range of 2-4; 3n+3m is in the range of 2-8; and respectively represent integers determined in accordance with the valence of the metal atoms represented by M1-M3.
More Like This:
| WO/1990/008844 | FORMING A METAL COATING |
Inventors:
NAGAI HIROKI (JP)
SATO MITSUNOBU (JP)
SATO MITSUNOBU (JP)
Application Number:
PCT/JP2017/003674
Publication Date:
August 10, 2017
Filing Date:
February 01, 2017
Export Citation:
Assignee:
UNIV KOGAKUIN (JP)
International Classes:
C23C18/08
Domestic Patent References:
| WO2015045932A1 | 2015-04-02 |
Foreign References:
| JPH1072673A | 1998-03-17 | |||
| JP2005035984A | 2005-02-10 | |||
| JP2005506901A | 2005-03-10 | |||
| JP2013510241A | 2013-03-21 | |||
| JP2008013466A | 2008-01-24 | |||
| JP2006028525A | 2006-02-02 | |||
| JP2007253352A | 2007-10-04 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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