Title:
METAL FOIL COMPOSITE STRUCTURE FOR PRODUCING CLAD LAMINATE
Document Type and Number:
WIPO Patent Application WO2004114730
Kind Code:
A3
Abstract:
A metal foil composite structure (10) used for the construction of clad laminate and printed circuit wiring boards comprises first and second conductive metal foil layers (12, 14) having substantially the same width. Each of the layers (12, 14) has opposite lateral edges (20). A carrier layer (16) is disposed between the first and second conductive metal layers (12, 14). The carrier layer (16) has a width less than the width of the first and second conductive metal layers (12, 14), and forms a margin at each of the lateral edges (20). The first and second conductive layers (12, 14) are joined to each other only within the margins. Strength provided by the carrier (16) enables thin conducting metal foils to be incorporated in clad laminates. Such foils, which may be as thin as 8 - 10 microns, are often too weak to be reliably self-supporting. The provision of a supporting carrier layer (16) enables the thin foils to be handled and bonded to a dielectric substrate in an efficient and economical manner. Defects in the resulting clad laminate, such as wrinking or creasing of the thin foil, are virtually eliminated. The composite foil structure (10) is readily formed in continuous, indeterminate lengths.
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Inventors:
WEEKES MICHAEL
SIRCO ANTHONY J
BLABER JOHN
SIRCO ANTHONY J
BLABER JOHN
Application Number:
PCT/US2004/019090
Publication Date:
June 02, 2005
Filing Date:
June 12, 2004
Export Citation:
Assignee:
OAK MITSUI INC (US)
International Classes:
B32B15/08; H05K3/02; (IPC1-7): B32B7/06; B32B15/20
Foreign References:
| US3932250A | 1976-01-13 | |||
| US6231944B1 | 2001-05-15 | |||
| JPH01191108B | ||||
| DE19831461C1 | 2000-02-24 |
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