METAL FOIL WITH CARRIER

WIPO Patent Application WO/2023/189839

A1

Provided is a metal foil with a carrier, such metal foil capable of suppressing unintended releasing of a metal layer, caused by the penetration of chemicals from an end. A copper foil with a carrier is provided with: a carrier including a first surface and a second surface that face each other, and a side surface that is connected to the first surface and the second surface; a release layer provided on the first surface of the carrier; and a metal layer that is provided on the release layer and that has a thickness of 0.01 μｍ to 4.0 μｍ. The metal layer extends from the first surface to the side surface of the carrier so that at least a portion of the side surface is covered by the metal layer. The carrier includes, on the side surface or on the side surface and the first surface, an uneven region in which a developed area ratio Sdr of an interface, measured in accordance with ISO 25178, is from 3% to 39%, and the uneven region encompasses the region of the side surface covered by the metal layer.

WO/2021/182380	ELECTROMAGNETIC-WAVE-TRANSMISSIVE LAMINATED MEMBER AND METHOD FOR MANUFACTURING SAME
JPS5435832	METHOD OF MAKING HIGHHDUCTILE ELECTROLYTICALLY TREATED COPPER FOIL

NAKAMURA TOSHIMI (JP)
KITABATAKE YUKIKO (JP)
MATSUURA YOSHINORI (JP)

PCT/JP2023/010949

October 05, 2023

March 20, 2023

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MITSUI MINING & SMELTING CO LTD (JP)

B32B15/04; B32B3/30; B32B7/06; B32B17/06; H05K1/09

WO2019188498A1	2019-10-03
WO2019163605A1	2019-08-29
WO2020031721A1	2020-02-13
WO2016067422A1	2016-05-06

JP2005193400A

2005-07-21

TAKAMURA Masaharu et al. (JP)

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