Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/189840
Kind Code:
A1
Abstract:
This semiconductor device comprises: a support substrate that has a first conductive portion and a second conductive portion; a plurality of first semiconductor elements that each have a switching function and that are mounted to the first conductive portion; a plurality of second semiconductor elements that each have a switching function and that are mounted to the second conductive portion; a first terminal that protrudes toward the x1 side of the x-direction relative to the first conductive portion; a first conductive member that electrically connects the plurality of first semiconductor elements and the second conductive portion; a second conductive member that electrically connects the plurality of second semiconductor elements and the first terminal; and a sealing resin that covers the plurality of first semiconductor elements, the plurality of second semiconductor elements, the first conductive member, the second conductive member, at least part of the support substrate, and at least part of the first terminal. The first terminal and the second conductive member are integratedly formed.
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Inventors:
FUJIMURA TOMOKI (JP)
TANIKAWA KOHEI (JP)
YASUNISHI TOMOHIRO (JP)
TANIKAWA KOHEI (JP)
YASUNISHI TOMOHIRO (JP)
Application Number:
PCT/JP2023/010950
Publication Date:
October 05, 2023
Filing Date:
March 20, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L25/07; H01L25/18
Domestic Patent References:
| WO2019098368A1 | 2019-05-23 | |||
| WO2022030244A1 | 2022-02-10 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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