Title:
METAL PASTE FOR JOINING, AND METHOD FOR MANUFACTURING JOINED BODY AND METHOD FOR MANUFACTURING INSULATED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/100917
Kind Code:
A1
Abstract:
A metal paste for joining according to the present invention contains a plasticizer comprising a metal powder, an acrylic resin, and an adipate ester, and a solvent, the plasticizer content being within the range of 3.2-10.4 mass%, and the ratio A/B of mass A of the plasticizer and mass B of the acrylic resin being within the range of 0.2 ≤ A/B ≤ 1.3.
Inventors:
SAKURAI AKIRA (JP)
TERASAKI NOBUYUKI (JP)
GOMYO MIKA (JP)
TERASAKI NOBUYUKI (JP)
GOMYO MIKA (JP)
Application Number:
PCT/JP2022/044096
Publication Date:
June 08, 2023
Filing Date:
November 30, 2022
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H01L23/12; C09J9/02; C09J11/04; C09J11/06; C09J133/00; H05K1/02
Domestic Patent References:
| WO2013115359A1 | 2013-08-08 |
Foreign References:
| JP2012172128A | 2012-09-10 | |||
| JP2010006929A | 2010-01-14 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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