Title:
METAL SURFACE LAYER LOW-TEMPERATURE CUTTING MACHINING METHOD AND DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/198998
Kind Code:
A1
Abstract:
Disclosed are a metal surface layer low-temperature cutting machining method and device. The machining method comprises: building a metal surface layer low-temperature cutting device; clamping a workpiece to be cut, and using the metal surface layer low-temperature cutting device to cool said workpiece, so that the surface layer of said workpiece forms a cooling layer, and the depth of the cooling layer is greater than a cutting depth; and after the temperature of the cooling layer reaches a preset temperature, using a cutter to perform cutting machining on said workpiece. According to the described machining method, cutting machining is performed while the surface of a material is cooled by using an ultralow-temperature cooling medium, simultaneously cooling and cutting can be achieved, and the residual stress state of the surface of the workpiece can further be regulated and controlled.
Inventors:
YAN PEI (CN)
SUN JIE (CN)
CHEN HAO (CN)
WANG XIBIN (CN)
JIAO LI (CN)
QIU TIANYANG (CN)
ZHAO WENXIANG (CN)
ZHOU TIANFENG (CN)
LIU ZHIBING (CN)
XIE LIJING (CN)
ZHAO BIN (CN)
LIANG ZHIQIANG (CN)
TENG LONGLONG (CN)
SHEN WENHUA (CN)
SUN JIE (CN)
CHEN HAO (CN)
WANG XIBIN (CN)
JIAO LI (CN)
QIU TIANYANG (CN)
ZHAO WENXIANG (CN)
ZHOU TIANFENG (CN)
LIU ZHIBING (CN)
XIE LIJING (CN)
ZHAO BIN (CN)
LIANG ZHIQIANG (CN)
TENG LONGLONG (CN)
SHEN WENHUA (CN)
Application Number:
PCT/CN2021/125008
Publication Date:
September 29, 2022
Filing Date:
October 20, 2021
Export Citation:
Assignee:
BEIJING INSTITUTE TECH (CN)
International Classes:
B23Q11/10
Domestic Patent References:
| WO2018127823A1 | 2018-07-12 |
Foreign References:
| CN113084589A | 2021-07-09 | |||
| CN112264835A | 2021-01-26 | |||
| CN209077872U | 2019-07-09 | |||
| CN110058621A | 2019-07-26 | |||
| CN210046388U | 2020-02-11 |
Attorney, Agent or Firm:
BEIJING INSTITUTE OF TECHNOLOGY PATENT CENTER (CN)
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