METHOD AND APPARATUS FOR MANUFACTURING LASER ELEMENT, LASER ELEMENT, AND ELECTRONIC DEVICE

Title:

METHOD AND APPARATUS FOR MANUFACTURING LASER ELEMENT, LASER ELEMENT, AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2023/145763

Kind Code:

A1

Abstract:

A method for manufacturing a laser element includes: a step of preparing a semiconductor substrate (10) having a base substrate (BK), a first growth-inhibiting part (5F) and a second growth-inhibiting part (5S) adjacent to each other across an opening (K), and a first semiconductor part (S1) having a longitudinal shape located above the first growth-inhibiting part (5F) and the second growth-inhibiting part (5S) from the opening (K); a step of forming over the first semiconductor part (S1) a second semiconductor part (S2) including ridges (RJ) located above the first growth-inhibiting part (5F); and a step of scribing a portion of a first laminate (LB1), which includes the first semiconductor part (S1) and the second semiconductor part (S2), on the side where the ridges (RJ) are located.

Inventors:

MURAKAWA KENTARO (JP)
KAWAGUCHI YOSHINOBU (JP)
KAMIKAWA TAKESHI (JP)

Application Number:

PCT/JP2023/002206

Publication Date:

August 03, 2023

Filing Date:

January 25, 2023

Export Citation:

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Assignee:

KYOCERA CORP (JP)

International Classes:

H01S5/22; H01S5/343

Domestic Patent References:

WO2018135207A1

2018-07-26

Foreign References:

JP2021525452A	2021-09-24
JP2013211596A	2013-10-10
JP2011035432A	2011-02-17
JP5151400B2	2013-02-27