Title:
METHOD AND APPARATUS FOR MOUNTING SOLDER BALL
Document Type and Number:
WIPO Patent Application WO/2007/086508
Kind Code:
A1
Abstract:
[PROBLEMS] To provide a solder ball mounting apparatus capable of mounting fine solder balls on electrodes. [MEANS FOR SOLVING THE PROBLEMS] The solder balls (78s) are collected by sucking air from a mounting tube (24) positioned above a ball arranging mask (16). A printed wiring board (10) and the ball arranging mask (16) are moved horizontally to move the solder balls (78s) collected just below the mounting tube (24) onto the ball arranging mask (16) and drop them onto the electrodes (75) of the multilayer printed wiring board (10) through the openings (16a) of the ball arranging mask (16).
Inventors:
TANNO KATSUHIKO (JP)
KAWAMURA YOUICHIROU (JP)
KAWAMURA YOUICHIROU (JP)
Application Number:
PCT/JP2007/051273
Publication Date:
August 02, 2007
Filing Date:
January 26, 2007
Export Citation:
Assignee:
IBIDEN CO LTD (JP)
TANNO KATSUHIKO (JP)
KAWAMURA YOUICHIROU (JP)
TANNO KATSUHIKO (JP)
KAWAMURA YOUICHIROU (JP)
International Classes:
H05K3/34; H01L21/60
Domestic Patent References:
| WO2006013742A1 | 2006-02-09 |
Foreign References:
| JP2003258016A | 2003-09-12 | |||
| JP2001244288A | 2001-09-07 |
Attorney, Agent or Firm:
TASHITA, Akihito (Sakae 1-chome Naka-k, Nagoya-shi Aichi 08, JP)
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