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Title:
METHOD AND APPARATUS FOR POLISHING PLATE-LIKE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2011/074615
Kind Code:
A1
Abstract:
Disclosed is a polishing method having improved operation efficiency in a polishing step without being affected by generation state of surface defects (17) on a glass plate (G) surface to be polished. The distribution state of the surface defects (17) of the glass plate (G) sucked to a suction sheet (3) on a table (2) is previously inspected, said distribution being in the Y axis direction within the surface, more polishing heads (5) that polish the surface of the glass plate (G) are disposed in a polishing lane (LB), which is a region where more surface defects (17) are present compared with a polishing lane (LA), i.e., a region having less surface defects (17), and the surface of the glass plate (G) is polished by moving the glass plate in the X axis direction.

Inventors:
ISHIMARU NAOHIKO (JP)
KIYAMA ATSUSHI (JP)
KOCHI TATSURO (JP)
Application Number:
PCT/JP2010/072587
Publication Date:
June 23, 2011
Filing Date:
December 15, 2010
Export Citation:
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Assignee:
ASAHI GLASS CO LTD (JP)
ISHIMARU NAOHIKO (JP)
KIYAMA ATSUSHI (JP)
KOCHI TATSURO (JP)
International Classes:
B24B7/06; B24B7/24; B24B27/033; B24B29/00
Foreign References:
JP2007190657A2007-08-02
JPH06292904A1994-10-21
JPH09103943A1997-04-22
JPH06179164A1994-06-28
Attorney, Agent or Firm:
OGURI Shohei et al. (JP)
Shohei Oguri (JP)
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