METHOD OF BARREL ELECTROPLATING WITH ALUMINUM OR ALUMINUM ALLOY

Title:

METHOD OF BARREL ELECTROPLATING WITH ALUMINUM OR ALUMINUM ALLOY

Document Type and Number:

WIPO Patent Application WO/2011/049066

Kind Code:

A1

Abstract:

A barrel electroplating method is provided in which a deposition failure and an adhesion failure such as blistering or delamination are less apt to occur regardless of the amount of a work to be plated and it is possible to obtain an even deposit having neither a burnt area nor a gloss failure. The method comprises using an aluminum or aluminum alloy plating bath to conduct barrel electroplating, and is characterized by rotating, rocking, or oscillating an anode (6) disposed within a barrel (4) in which a work to be plated has been disposed, applying a voltage between the anode and a cathode disposed on the inner wall of the barrel, and rotating, rocking, or oscillating the barrel.

Inventors:

INOUE MANABU (JP)
ONUMA TADAHIRO (JP)
INOMATA TOSHIKI (JP)
MIYADERA TSUTOMU (JP)

Application Number:

PCT/JP2010/068328

Publication Date:

April 28, 2011

Filing Date:

October 19, 2010

Export Citation:

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Assignee:

DIPSOL CHEM (JP)
HONDA MOTOR CO LTD (JP)
INOUE MANABU (JP)
ONUMA TADAHIRO (JP)
INOMATA TOSHIKI (JP)
MIYADERA TSUTOMU (JP)

International Classes:

C25D17/20; C25D3/44; C25D3/56

Foreign References:

JPH02153100A	1990-06-12
JP2005060822A	2005-03-10
JP2009185381A	2009-08-20
JP2009235486A	2009-10-15
JPS49130A	1974-01-05

Other References:

YOSHIAKI HOSHINO, NP SERIES, 25 May 1995 (1995-05-25), pages 8 - 9, 24 TO 26, 127 TO 128, XP008155794
See also references of EP 2492376A4

Attorney, Agent or Firm:

TSUJII Koichi et al. (JP)
辻居 Koichi (JP)

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