Title:
SUBSTRATE FOR POWER MODULE, SUBSTRATE WITH HEAT SINK FOR POWER MODULE, POWER MODULE, METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE, AND METHOD FOR PRODUCING SUBSTRATE WITH HEAT SINK FOR POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2011/049067
Kind Code:
A1
Abstract:
Disclosed is a substrate for a power module, which comprises a ceramic substrate and a metal plate that is laminated on and bonded to a surface of the ceramic substrate and composed of aluminum or an aluminum alloy. One or more additional elements selected from among Ag, Zn, Ge, Mg, Ca, Ga and Li are solid-solved in the metal plate. The Ag concentration of the metal plate in the vicinity of the interface with the ceramic substrate is set to be 0.05-10% by mass (inclusive), or the total concentration of Zn, Ge, Mg, Ca, Ga and Li of the metal plate in the vicinity of the interface with the ceramic substrate is set to be 0.01-5% by mass (inclusive).
Inventors:
NAGATOMO YOSHIYUKI (JP)
AKIYAMA KAZUHIRO (JP)
TONOMURA HIROSHI (JP)
TERASAKI NOBUYUKI (JP)
KUROMITSU YOSHIROU (JP)
AKIYAMA KAZUHIRO (JP)
TONOMURA HIROSHI (JP)
TERASAKI NOBUYUKI (JP)
KUROMITSU YOSHIROU (JP)
Application Number:
PCT/JP2010/068332
Publication Date:
April 28, 2011
Filing Date:
October 19, 2010
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
NAGATOMO YOSHIYUKI (JP)
AKIYAMA KAZUHIRO (JP)
TONOMURA HIROSHI (JP)
TERASAKI NOBUYUKI (JP)
KUROMITSU YOSHIROU (JP)
NAGATOMO YOSHIYUKI (JP)
AKIYAMA KAZUHIRO (JP)
TONOMURA HIROSHI (JP)
TERASAKI NOBUYUKI (JP)
KUROMITSU YOSHIROU (JP)
International Classes:
H01L23/36; H01L23/12
Foreign References:
| JPH11163209A | 1999-06-18 | |||
| JP2006240955A | 2006-09-14 | |||
| JP2008311294A | 2008-12-25 | |||
| JP2003086744A | 2003-03-20 | |||
| JP2008311294A | 2008-12-25 | |||
| JPH03234045A | 1991-10-18 |
Other References:
See also references of EP 2492958A1
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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