Title:
METHOD FOR BONDING METALLIC MEMBERS, BONDED METALLIC-MEMBER OBJECT, AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2020/071471
Kind Code:
A1
Abstract:
The method for bonding metallic members according to an aspect of the present invention is a method for bonding metallic members to each other which comprises: a step in which a silver ink composition adherent to a surface of a first metallic member and/or a surface of a second metallic member is heated at a temperature of 60°C or higher without being solidified, thereby obtaining the silver ink composition in a heated state; and a step in which the silver ink composition in the heated state is interposed between the first member and the second member and burned while press-bonding the first and second members, thereby bonding the first member to the second member with silver metal. The silver ink composition comprises a silver carboxylate having the group represented by the formula -COOAg, an amine compound, and formic acid. The silver ink composition is a material for forming silver metal therefrom through burning.
Inventors:
SEKIGUCHI TAKUYA (JP)
SUGANUMA KATSUAKI (JP)
LI WANLI (JP)
CHEN CHUANTONG (JP)
SUGANUMA KATSUAKI (JP)
LI WANLI (JP)
CHEN CHUANTONG (JP)
Application Number:
PCT/JP2019/039066
Publication Date:
April 09, 2020
Filing Date:
October 03, 2019
Export Citation:
Assignee:
TOPPAN FORMS CO LTD (JP)
UNIV OSAKA (JP)
UNIV OSAKA (JP)
International Classes:
H05K3/32; C09J5/06; C09J9/02; H05K1/18
Foreign References:
| JP2014193991A | 2014-10-09 | |||
| JP2008159535A | 2008-07-10 | |||
| JP2013214733A | 2013-10-17 | |||
| JP2016010959A | 2016-01-21 |
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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