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Patent Searching and Data


Title:
METHOD FOR BONDING THREAD-LIKE ADHESIVE BODY AND THREAD-LIKE ADHESIVE BODY BONDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/190420
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a method for bonding a thread-like adhesive body, the method enabling the achievement of different adhesive characteristics by means of the orientation of the external force in the shear direction, while having excellent reworkability. The present invention relates to a method for bonding a thread-like adhesive body, the method comprising a step in which the thread-like adhesive body in the shape described below is bonded to an adherend. If an ABS resin plate is arranged on the thread-like adhesive body which has been bonded to another ABS resin plate, and the resulting material is subjected to a tensile test, the thread-like adhesive body is in such a shape that, with respect to the shear strength (N/mm2) which is obtained by converting the load (N) at the time when a shear fracture occurred into the value per unit area (mm2) of the bonding area of the thread-like adhesive body to the ABS resin plate, a shear strength Q(0°) in the direction in which the shear strength becomes maximum and a shear strength Q(90°) in a direction that is at an angle of 90° with respect to the direction in which the shear strength becomes maximum satisfy the relational expression described below. 1.1 ≤ Q(0°)/Q(90°)

Inventors:
SHIMOKAWA KAYO (JP)
MORISHITA HIROMITSU (JP)
TAKASHIMA ATSUSHI (JP)
MAKIHATA YOSUKE (JP)
Application Number:
PCT/JP2023/012351
Publication Date:
October 05, 2023
Filing Date:
March 27, 2023
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J201/00; B29C65/52
Foreign References:
JP2021055091A2021-04-08
US20150158634A12015-06-11
Attorney, Agent or Firm:
EIKOH, P.C. (JP)
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