Title:
RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/190419
Kind Code:
A1
Abstract:
The present invention provides a resin composition for molding, the resin composition containing a curable resin, and an inorganic filler that contains silica particles and/or alumina particles, and calcium titanate particles. The content ratio of the calcium titanate particles is not less than 10% by volume but less than 30% by volume relative to the entirety of the inorganic filler; and the content ratio of the entirety of the inorganic filler is more than 60% by volume relative to the entirety of the resin composition for molding.
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Inventors:
YAMAURA MASASHI (JP)
Application Number:
PCT/JP2023/012350
Publication Date:
October 05, 2023
Filing Date:
March 27, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C08L101/00; C08K3/22; C08K3/24; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2019131095A1 | 2019-07-04 |
Foreign References:
| JP6870778B1 | 2021-05-12 | |||
| JP2020122115A | 2020-08-13 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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