Title:
METHOD FOR CLEANING SUBSTRATE AND APPARATUS FOR CLEANING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2010/035396
Kind Code:
A1
Abstract:
Disclosed are a method for cleaning a substrate and an apparatus for cleaning a substrate that remove contaminants such as particles adhered onto the surface of the substrate. The method and the apparatus can realize a high throughput and, at the same time, can effectively remove particles and the like.
In order to clean the backside (Wb) of a substrate (W), DIW cooled to a temperature around the solidification point of DIW and a cooling gas of a temperature below the solidification point of DIW are ejected toward the center of the lower surface of the substrate being rotated. The cooled DIW, when flown along the backside (Wb) of the substrate, removes particles and the like adhered onto the substrate.
Inventors:
FUJIWARA NAOZUMI (JP)
KATO MASAHIKO (JP)
MIYA KATSUHIKO (JP)
KATO MASAHIKO (JP)
MIYA KATSUHIKO (JP)
Application Number:
PCT/JP2009/004010
Publication Date:
April 01, 2010
Filing Date:
August 21, 2009
Export Citation:
Assignee:
DAINIPPON SCREEN MFG (JP)
FUJIWARA NAOZUMI (JP)
KATO MASAHIKO (JP)
MIYA KATSUHIKO (JP)
FUJIWARA NAOZUMI (JP)
KATO MASAHIKO (JP)
MIYA KATSUHIKO (JP)
International Classes:
H01L21/304; B08B3/04; B08B3/10
Foreign References:
JP2008071875A | 2008-03-27 | |||
JP2008130822A | 2008-06-05 |
Attorney, Agent or Firm:
FURIKADO, Shoichi et al. (JP)
Swing angle Shoichi (JP)
Swing angle Shoichi (JP)
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