Title:
METHOD FOR CUTTING GLASS SUBSTRATE, GLASS SUBSTRATE, NEAR INFRARED RAY CUT FILTER GLASS AND METHOD FOR MANUFACTURING GLASS SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2014/119780
Kind Code:
A1
Abstract:
Provided are: a method for cutting a glass substrate which efficiently forms a modified region inside the glass substrate to enable easy cutting thereof; a glass substrate; and a near infrared ray cut filter glass. The method for cutting a glass substrate according to the present invention is characterized in that the method comprises a step of applying light to the glass substrate so as to focus the light to the inside of the glass substrate and selectively forming a modified region inside the glass substrate and a step of generating a crack in the thickness direction of the glass substrate with the modified region being the starting point and cutting the glass substrate along the modified region, and in that the glass substrate has a fracture toughness of 0.1 to 0.74 MPa∙m1/2.
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Inventors:
MASUDA HIDETAKA (JP)
OBANA YOSHIKI (JP)
KUNO KAZUHIDE (JP)
OBANA YOSHIKI (JP)
KUNO KAZUHIDE (JP)
Application Number:
PCT/JP2014/052421
Publication Date:
August 07, 2014
Filing Date:
February 03, 2014
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
C03B33/09; B23K26/38; B23K26/40; C03C3/247
Domestic Patent References:
| WO2013180012A1 | 2013-12-05 |
Foreign References:
| JP2010177340A | 2010-08-12 | |||
| JP2011068542A | 2011-04-07 | |||
| JP2012208527A | 2012-10-25 | |||
| JP2005320178A | 2005-11-17 |
Attorney, Agent or Firm:
SAKURA PATENT OFFICE, p. c. (JP)
Patent business corporation cherry tree international patent firm (JP)
Patent business corporation cherry tree international patent firm (JP)
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