Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD FOR CUTTING MOLDED CORES USED FOR COIL COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2016/195004
Kind Code:
A1
Abstract:
The present invention provides a method for cutting molded cores, said method enabling molded cores that include magnetic bodies to be collectively cut. This method for cutting molded cores 20 involves cutting molded cores, each of which includes an annular magnetic body comprising a magnetic material and an insulating resin cover that covers the magnetic body, at a first cut section and a second cut section that traverse the outer peripheral surface and the inner peripheral surface and that come closer to each other in the inner peripheral direction of the molded cores, thereby obtaining a body 30, which comprises a body-side first end face that has been cut at the first cut section and a body-side second end face that has been cut at the second cut section, and a segment 40, which comprises a segment-side first end face that has been cut at the first cut section and a segment-side second end face that has been cut at the second cut section, for each molded core, wherein, the plurality of molded cores are connected side-by-side such that the sides face each other, and the connected plurality of molded cores are cut at the first cut section and the second cut section of each molded core so as to traverse the outer peripheral surface and the inner peripheral surface thereof.

Inventors:
INOUE MASAFUMI (JP)
TAKAHASHI YASUOMI (JP)
IMANISHI TSUNETSUGU (JP)
YOSHIMORI HITOSHI (JP)
Application Number:
PCT/JP2016/066367
Publication Date:
December 08, 2016
Filing Date:
June 02, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHT CORP LTD (JP)
International Classes:
H01F41/02; H01F27/24
Foreign References:
JPS5329527A1978-03-18
JPH04206909A1992-07-28
Other References:
See also references of EP 3306630A4
Attorney, Agent or Firm:
MARUYAMA & CO. (JP)
Patent business corporation Maruyama international patent firm (JP)
Download PDF:



 
Previous Patent: COIL DEVICE

Next Patent: ACTIVE MATRIX SUBSTRATE