METHOD AND DEVICE FOR LASER CUTTING PROCESS

Title:

METHOD AND DEVICE FOR LASER CUTTING PROCESS

Document Type and Number:

WIPO Patent Application WO/2013/039161

Kind Code:

A1

Abstract:

　In order to enable the implementation of a laser cutting process which is similar to that carried out by a CO2 laser, even when oxygen gas and/or air is used as an assist gas during the implementation of a laser cutting process using a fibre laser on a mild steel sheet, the present invention provides a device and method for a laser cutting process for laser cutting a metal workpiece by means of a laser beam having a wavelength with a band of 1μm, wherein when the workpiece is laser cut by means of a ring beam which has passed through the focal position in a condensing lens (13) and in which both the internal diameter and the external diameter are increasing, the external diameter of the ring beam is 300-600μm, the internal diameter ratio is 30-70%, and the focal depth of the condensing lens is 2-5mm.

Inventors:

SUGIYAMA AKIHIKO (JP)
ISHIGURO HIROAKI (JP)

Application Number:

PCT/JP2012/073497

Publication Date:

March 21, 2013

Filing Date:

September 13, 2012

Export Citation:

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Assignee:

AMADA CO LTD (JP)
SUGIYAMA AKIHIKO (JP)
ISHIGURO HIROAKI (JP)

International Classes:

B23K26/073; B23K26/08; B23K26/38; B23K26/382; G02B13/00

Domestic Patent References:

WO2010095744A1

2010-08-26

Foreign References:

JP2011121107A	2011-06-23
JP2010194558A	2010-09-09
JPH1114945A	1999-01-22
JPH1158059A	1999-03-02
JP2011203416A	2011-10-13
JP2012177867A	2012-09-13

Other References: