Title:
METHOD FOR DIVIDING COMPOSITE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2021/009961
Kind Code:
A1
Abstract:
[Problem] To provide a method which is capable of dividing a composite material, wherein a brittle material layer and a resin layer are superposed upon each other, without causing cracks in end surfaces of the brittle material layer. [Solution] The present invention is a method for dividing a composite material 10 wherein a brittle material layer 1 and a resin layer 2 are superposed upon each other, said method comprising: a resin removal step wherein the resin layer is irradiated with laser light L1 oscillated from a CO2 laser light source 20 along a planned dividing line DL of the composite material, thereby forming a processing groove 25 that extends along the planned dividing line; and a brittle material removal step wherein the brittle material layer is irradiated with laser light L2 oscillated from an ultrashort pulse laser light source 30 along the planned dividing line after the resin removal step, thereby forming a processing mark 11 that extends along the planned dividing line. This method is characterized in that, in the resin removal step, a region IS where planned dividing lines intersect is not irradiated a plurality of times with the laser light oscillated from the CO2 laser light source, or alternatively, the irradiation quantity of laser light in the region IS where planned dividing lines intersect is decreased in comparison to the regions other than the region where planned dividing lines intersect.
Inventors:
KANNO TOSHIHIRO (JP)
SHINOZAKI TAKAHIRO (JP)
NAKAI KOTA (JP)
MATSUO NAOYUKI (JP)
SHINOZAKI TAKAHIRO (JP)
NAKAI KOTA (JP)
MATSUO NAOYUKI (JP)
Application Number:
PCT/JP2020/006412
Publication Date:
January 21, 2021
Filing Date:
February 19, 2020
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C03B33/033; B23K26/364; B28D5/00; C03B33/07; C03B33/09; G02B5/30; G02F1/1335
Domestic Patent References:
| WO2013175767A1 | 2013-11-28 |
Foreign References:
| JP2011178636A | 2011-09-15 | |||
| JP2017145188A | 2017-08-24 | |||
| JP2018170474A | 2018-11-01 | |||
| JP2012240881A | 2012-12-10 | |||
| JP2014105147A | 2014-06-09 | |||
| JP2018519229A | 2018-07-19 | |||
| JP2011178636A | 2011-09-15 | |||
| JPS6239461B2 | 1987-08-24 | |||
| JP2012073580A | 2012-04-12 |
Other References:
JOHN LOPEZ ET AL.: "GLASS CUTTING USING ULTRASHORT PULSED BESSEL BEAMS", INTERNATIONAL CONGRESS ON APPLICATIONS OF LASERS & ELECTRO-OPTICS (ICALEO, October 2015 (2015-10-01), Retrieved from the Internet
Attorney, Agent or Firm:
MAKOTO INTERNATIONAL PATENT ATTORNEYS OFFICE (JP)
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