Title:
METHOD FOR EVALUATING BONDING STRENGTH OF ROUGHENED SURFACE OF COPPER FOIL
Document Type and Number:
WIPO Patent Application WO/2005/095951
Kind Code:
A1
Abstract:
A method for evaluating the bonding strength of the roughened surface of a copper coil capable of estimating the bonding strength of the roughened surface of a copper coil with high precision from the parameters, e.g. roughness, of the roughened surface of a copper coil without actually measuring the bonding strength of the roughened surface of a copper coil, wherein an area factor C(S) defined by A(S)/B(S) from a three-dimensional surface area A(S) being obtained by measuring the surface area of the roughened surface of a copper coil sample S three-dimensionally by means of a laser microscope, and a measurement zone area B(S) of the three-dimensional surface area A(S) is determined, a calculated bonding strength P(R) is determined by applying the area factor C(S) to a calibration curve R indicative of the relation between an area factor C and a bonding strength P predetermined for the roughened surface of the same kind of copper coil as the copper foil sample S, and the calculated bonding strength P(R) is evaluated, in place of the actually measured bonding strength P(S) of the roughened surface of the copper foil sample S, as the bonding strength of the roughened surface of the copper foil sample S.
Inventors:
IWAKIRI KENICHIRO (JP)
NAGATANI SEIJI (JP)
NAGATANI SEIJI (JP)
Application Number:
PCT/JP2005/006295
Publication Date:
October 13, 2005
Filing Date:
March 31, 2005
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
IWAKIRI KENICHIRO (JP)
NAGATANI SEIJI (JP)
IWAKIRI KENICHIRO (JP)
NAGATANI SEIJI (JP)
International Classes:
G01N19/04; G01B11/30; G01N33/20; H05K3/38; (IPC1-7): G01N33/20
Foreign References:
| JPH08111582A | 1996-04-30 | |||
| JPH08313428A | 1996-11-29 |
Attorney, Agent or Firm:
Yoshimura, Katsuhiro c/o Yoshimura International Patent Office (Omiya F bldg. 5-4, Sakuragicho 2-chome, Omiya-k, Saitama-shi Saitama 54, JP)
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