METHOD OF FORMING CONDUCTIVE SECTION THAT FORMS PATTERN ON SUBSTRATE

Title:

METHOD OF FORMING CONDUCTIVE SECTION THAT FORMS PATTERN ON SUBSTRATE

Document Type and Number:

WIPO Patent Application WO/2021/140709

Kind Code:

A1

Abstract:

The purpose of the invention is to provide a method of forming a conductive section that forms a pattern on a substrate, in which deformation of a wiring pattern transferred to and formed on the substrate is minimized, complete transfer is enabled, and throughput can be improved. In this method, a recess 3 in a substrate 1 is filled with an active-light-curable-resin-containing conductive paste 4 containing an active-light-curable resin of which the average particle diameter is set to 0.1-20 μm, a print plate 2 is laid over the substrate 1, active light rays are radiated from the print plate 2 side to cure an interface portion of the active-light-curable-resin-containing conductive paste 4 that is in contact with at least the recess 3, and the print plate 2 is then separated from the substrate 1 to transfer the active-light-curable-resin-containing conductive paste 4 to the substrate 1 and form a conductive section 5 having a prescribed pattern on the substrate 1.

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Inventors:

KOMATSU HIROSHI (JP)

Application Number:

PCT/JP2020/035464

Publication Date:

July 15, 2021

Filing Date:

September 18, 2020

Export Citation:

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Assignee:

CONNECTEC JAPAN CORP (JP)

International Classes:

B41M3/00; B41M1/10; H05K3/20

Foreign References:

JPH11154782A	1999-06-08
JP2003298214A	2003-10-17
JP2016058664A	2016-04-21

Other References: