Title:
METHOD FOR FORMING MICRO-BUMP ON METAL SURFACE
Document Type and Number:
WIPO Patent Application WO/2016/161692
Kind Code:
A1
Abstract:
The present invention relates to the field of laser micro-processing. Provided is a method for forming micro-bumps on a metal surface. The method comprises: sequentially, coating a bonding layer (2) onto a surface of a metal workpiece (1), punching holes on the bonding layer (2), attaching with an absorption layer (4) and covering with a transparent restraint layer (5); via laser radiation, the absorption layer (4) absorbs laser energy and generates plasma (7); the plasma (7) generates high-amplitude shock waves (8); the high-amplitude shock waves (8) pass through the bonding layer (2) and form penetrating shock waves (9); and the shock waves act on the surface of the metal workpiece (1), forming micro-bumps (10) on the surface of the metal workpiece (1) having the corresponding shape, size and distribution to the holes (3). The method is simple, reliably realizes a convex angle of the metal surface, obtains the bumps in any shape, forms a convex topography on the metal surface and strengthens the metal surface.
Inventors:
YE YUNXIA (CN)
XUAN TING (CN)
ZUO HUI (CN)
WANG FENG (CN)
FU YONGHONG (CN)
HUA XIJUN (CN)
ZHOU JIANZHONG (CN)
XUAN TING (CN)
ZUO HUI (CN)
WANG FENG (CN)
FU YONGHONG (CN)
HUA XIJUN (CN)
ZHOU JIANZHONG (CN)
Application Number:
PCT/CN2015/078916
Publication Date:
October 13, 2016
Filing Date:
May 14, 2015
Export Citation:
Assignee:
UNIV JIANGSU (CN)
International Classes:
B23K26/18; B23K26/354
Domestic Patent References:
| WO2001056736A2 | 2001-08-09 |
Foreign References:
| CN104308361A | 2015-01-28 | |||
| CN102626826A | 2012-08-08 | |||
| JPH01262087A | 1989-10-18 |
Attorney, Agent or Firm:
JW IP LAW FIRM (CN)
北京德崇智捷知识产权代理有限公司 (CN)
北京德崇智捷知识产权代理有限公司 (CN)
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