Title:
METHOD OF FORMING A SPUTTERING TARGET ASSEMBLY AND ASSEMBLY MADE THEREFROM
Document Type and Number:
WIPO Patent Application WO2004038062
Kind Code:
A3
Abstract:
A method of forming a sputtering target assembly and the sputtering target assembly made therefrom are described. The method includes bonding a sputtering target to a backing plate at a low temperature by providing projections and grooves in the baching plate and the target and deforming the projections to at least partially fill the grooves. Also described is a method of forming a sputtering target assembly such that a gap is formed between the sputtering target and the backing plate. Also described is a method of forming a sputtering target assembly providing a mechanism to prevent unintended sputtering into the backing plate.
Inventors:
WICKERSHAM CHARLES E JR
WORKMAN DAVID P
WORKMAN DAVID P
Application Number:
PCT/US2003/033249
Publication Date:
December 09, 2004
Filing Date:
October 20, 2003
Export Citation:
Assignee:
CABOT CORP (US)
International Classes:
B21K25/00; B23K1/00; C23C14/34; (IPC1-7): C23C14/34
Domestic Patent References:
| WO2002049785A1 | 2002-06-27 | |||
| WO2002047865A1 | 2002-06-20 | |||
| WO1990010947A1 | 1990-09-20 |
Foreign References:
| US5269899A | 1993-12-14 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 0111, no. 63 (C - 424) 26 May 1987 (1987-05-26)
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