Title:
SUBSTITUTION TYPE ELECTROLESS GOLD PLATING BATH
Document Type and Number:
WIPO Patent Application WO/2004/038063
Kind Code:
A1
Abstract:
A substitution type electroless gold plating bath that can prevent the oxidation of the surface of metal to be gold plated without the use of any reducing agent and can form a gold plating of excellent soldering characteristics. The substitution type electroless gold plating bath comprises a water-soluble gold salt, a conductivity enhancer, a chelating agent of imino diacetic acid structure, a surface oxidation inhibitor constituted of an organic compound having two or more nitrogen atoms in its main chain or ring and, as remainder, a solvent.
Inventors:
SHIMIZU SHIGEKI (JP)
TAKASAKI RYUJI (JP)
KIYOHARA YOSHIZOU (JP)
YOSHIBA KENJI (JP)
TAKASAKI RYUJI (JP)
KIYOHARA YOSHIZOU (JP)
YOSHIBA KENJI (JP)
Application Number:
PCT/JP2003/013243
Publication Date:
May 06, 2004
Filing Date:
October 16, 2003
Export Citation:
Assignee:
NIHON KOUJUNDO KAGAKU CO LTD (JP)
SHIMIZU SHIGEKI (JP)
TAKASAKI RYUJI (JP)
KIYOHARA YOSHIZOU (JP)
YOSHIBA KENJI (JP)
SHIMIZU SHIGEKI (JP)
TAKASAKI RYUJI (JP)
KIYOHARA YOSHIZOU (JP)
YOSHIBA KENJI (JP)
International Classes:
C23C18/42; (IPC1-7): C23C18/42
Foreign References:
| JP2003277942A | 2003-10-02 | |||
| US6398856B1 | 2002-06-04 |
Attorney, Agent or Firm:
Yoshitake, Kenji (Room 323 Fuji Bldg., 2-3, Marunouchi 3-chom, Chiyoda-ku Tokyo, JP)
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