Title:
METHOD FOR FORMING WIRING HOLE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/094457
Kind Code:
A1
Abstract:
A wiring hole 8 is formed in a liquid crystal panel 1 that is provided with a first glass substrate 3, a second glass substrate 4 that is disposed to face the first glass substrate 3, and a seal member 5 that is disposed between the substrates 3, 4. The wiring hole 8, which penetrates the first glass substrate 3 and the seal member 5 in the thickness direction, and which has a hole bottom 8a within the thickness of the second glass substrate 4, is formed by irradiating the liquid crystal panel 1 with a pulsed laser beam 2 from the first glass substrate 3 side.
Inventors:
ITOH SHO (JP)
Application Number:
PCT/JP2016/083126
Publication Date:
June 08, 2017
Filing Date:
November 08, 2016
Export Citation:
Assignee:
NIPPON ELECTRIC GLASS CO (JP)
International Classes:
G09F9/30; B23K26/00; B23K26/386; G02F1/1333; G02F1/1345; G09F9/00; H01L51/50; H05B33/02; H05B33/04; H05B33/06; H05B33/10; H05K3/00
Foreign References:
| JP2002040472A | 2002-02-06 | |||
| JP2000131707A | 2000-05-12 | |||
| JP2001022294A | 2001-01-26 | |||
| JP2008119698A | 2008-05-29 | |||
| JP2011164569A | 2011-08-25 | |||
| JP2014127701A | 2014-07-07 | |||
| JP2014154621A | 2014-08-25 | |||
| JP2015229167A | 2015-12-21 |
Attorney, Agent or Firm:
SHIROMURA Kunihiko et al. (JP)
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