Title:
METHOD FOR IMPROVING SURFACE EVENNESS OF ELECTROPLATED PLATINUM, AND POLISHING DEVICE USED BY METHOD
Document Type and Number:
WIPO Patent Application WO/2022/077614
Kind Code:
A1
Abstract:
A method for improving surface evenness of electroplated platinum and a polishing device used by the method. The method comprises the following steps: S1. performing drilling wave crest polishing; S2. performing visual inspection and determining whether to perform drilling wave crest polishing again; S3, electroplating a copper plate; S4, polishing the electroplated copper plate by using a polishing device, and adjusting the evenness thereof; and S5, performing visual inspection on the surface of the polished copper plate, performing checking by using a copper thickness checker, and determining whether to polish an electroplated layer again. By means of the design and cooperation of a guide groove, a linear sliding table and a push block in the polishing device, a workpiece can be moved, adjusted, aligned and clamped, such that a stable polishing condition is provided for the workpiece; and by means the cooperation of a hydraulic cylinder, a frame body, a first polishing structure and a second polishing structure, the hydraulic cylinder can drive the first polishing structure and the second polishing structure to make contact with the workpiece, so as to realize polishing, thereby effectively improving the polishing production efficiency.
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Inventors:
CHEN TING KUI (CN)
Application Number:
PCT/CN2020/126246
Publication Date:
April 21, 2022
Filing Date:
November 03, 2020
Export Citation:
Assignee:
BRAIN POWER QING YUAN CO LTD (CN)
International Classes:
B24B1/00; B24B7/07; B24B41/00; B24B41/06; B24B49/04; C25D5/52
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Attorney, Agent or Firm:
GUANGZHOU GAOJU INTELLECTUAL PROPERTY AGENCY CO., LTD (CN)
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