Title:
METHOD FOR JOINING WIRE TERMINALS
Document Type and Number:
WIPO Patent Application WO/2012/029480
Kind Code:
A1
Abstract:
Provided is a method for joining line terminals that is capable of joining the conductors of a plurality of wires in an extremely easy and certain manner with a high join strength. The method for joining line terminals, which applies an ultrasound vibration in a predetermined direction (A) to a conductor bundle (13) that bundles conductors (12) exposed from the plurality of wires (11), causing the conductors (12) to join to and unify with each other, contains: a conductor-bundle-forming step for forming a conductor bundle (13) by bundling conductors (12) while interposing the connection section (24) of a connection metal member (21) comprising a metal foil (22) between conductors (12) that are adjacent in the predetermined direction (A) that is the direction of application of the ultrasound vibration; and an ultrasonic welding step for applying an ultrasound vibration to the formed conductor bundle (13) while applying pressure in the predetermined direction (A), joining and unifying the conductors (12) to each other.
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| WO/2006/068228 | SOLDER PROCESSING METHOD AND CONNECTOR SUBJECTED TO SUCH PROCESSING |
| JPH0818214 | HEATING DEVICE FOR ELECTRONIC PART |
| JP2002199538 | CONNECTING METHOD FOR WIRE |
Inventors:
NABETA YASUNORI
ITO NAOKI
ITO NAOKI
Application Number:
PCT/JP2011/067447
Publication Date:
March 08, 2012
Filing Date:
July 29, 2011
Export Citation:
Assignee:
YAZAKI CORP (JP)
NABETA YASUNORI
ITO NAOKI
NABETA YASUNORI
ITO NAOKI
International Classes:
H01R43/02; H01B13/00
Foreign References:
| JPH07192838A | 1995-07-28 | |||
| JPS60175383A | 1985-09-09 |
Attorney, Agent or Firm:
HONDA Hironori et al. (JP)
Hironori Honda (JP)
Hironori Honda (JP)
Download PDF:
Claims: