METHOD FOR LAP-JOINT BONDING OF TWO SUBSTANCES BY LASER, AND BONDING DEVICE

WIPO Patent Application WO/2011/115242

A1

Provided is a method for lap-joint bonding of two substances by layer, with which it is possible to perform bonding without gaps between facing surfaces, when two substances are laid against one another. Also provided is a bonding device. The bonding method involves using a convergent lens (4) to subject the area in the vicinity of a gap (G) between overlaid facing surfaces (6a, 7b) of the overlaid two substances (6 and 7) to convergent beam irradiation with a high-energy short-pulse laser to bring about multiple-photo absorption to bond the two surfaces together, and is characterized by comprising: a gap reduction step in which the vicinity of the gap (G) is subjected to convergent beam radiation with a first high-energy short-pulse laser (L1) to bring about multiple-photon absorption and reduce the gap (G); and a bonding step in which the gap portion reduced in the gap reduction step is subjected to convergent beam radiation with a second high-energy low-pulse laser (L2) to bond the two substances (6, 7).

OTA MICHIHARU (JP)

PCT/JP2011/056519

September 22, 2011

March 14, 2011

Click for automatic bibliography generation  

AISIN SEIKI (JP)
OTA MICHIHARU (JP)

B23K26/20; B23K26/00; B23K26/06; C03B23/203

WO2008035770A1

2008-03-27

JP2008062263A	2008-03-21
JP2001232687A	2001-08-28
JP2001334578A	2001-12-04
JP2005066629A	2005-03-17
JP2007000914A	2007-01-11
JP2007008808A	2007-01-18

OHKAWA, HIROSHI (JP)
Okawa 宏 (JP)

View/Download PDF      PDF Help

Previous Patent: PEDOMETER FOR SHOE

Next Patent: PULSE LASER DEVICE, TRANSPARENT MEMBER WELDING METHOD, AND TRANSPARENT MEMBER WELDING DEVICE