Title:
METHOD FOR MAKING HIGH-DENSITY ELECTRICAL INTERCONNECTIONS USING RIVET BONDS
Document Type and Number:
WIPO Patent Application WO/2013/033034
Kind Code:
A3
Abstract:
A method of making high-density electrical interconnects between micro-electronic components using rivet bonds, by positioning a first substrate over a second substrate to align a through-hole and adjacent first metal bond pad of the first substrate with a second metal bond pad of the second substrate, and forming a metal bump through the through-hole so that the metal bump bonds to and electrically connects the first and second metal bond pads via the through-hole.
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Inventors:
SHAH KEDAR G (US)
PANNU SATINDERPALL S (US)
TOOKER ANGELA C (US)
PANNU SATINDERPALL S (US)
TOOKER ANGELA C (US)
Application Number:
PCT/US2012/052552
Publication Date:
April 25, 2013
Filing Date:
August 27, 2012
Export Citation:
Assignee:
L LIVERMORE NAT SECURITY LLC (US)
SHAH KEDAR G (US)
PANNU SATINDERPALL S (US)
TOOKER ANGELA C (US)
SHAH KEDAR G (US)
PANNU SATINDERPALL S (US)
TOOKER ANGELA C (US)
International Classes:
H01L21/60; H05K3/32; H05K3/40
Foreign References:
| US5048747A | 1991-09-17 | |||
| US20030059642A1 | 2003-03-27 | |||
| US20070231964A1 | 2007-10-04 | |||
| US20020074381A1 | 2002-06-20 | |||
| KR20020005592A | 2002-01-17 | |||
| KR20070096016A | 2007-10-01 |
Attorney, Agent or Firm:
TAK, James S. (7000 East AvenueP.O. Box 808, L-70, Livermore California, US)
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