Title:
METHOD FOR MANUFACTURING COAXIAL CABLE HAVING ATTACHED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2013/133409
Kind Code:
A1
Abstract:
One of the purposes of the present invention is to provide a method for manufacturing coaxial cable having an attached substrate, by which it is possible for a fine electrical wires to be readily and reliably connected by soldering to electrode pads arranged at high density on an insulating substrate. The present invention is a method for manufacturing a coaxial cable having an attached substrate, by connecting a plurality of fine electrical wires (10) through soldering to a plurality of electrode pads (22) arranged at high density on a wiring substrate (20), and is provided with a step of applying and reflowing a predetermined amount of solder powder on the plurality of electrode pads (22) of the wiring substrate, to form a solder precoat (24). The center conductors (11) of the plurality of fine electrical wires are then arranged over the plurality of electrode pads (22) on which the solder precoat (24) has been formed, and the center conductors (11) of the fine electrical wires are connected by soldering to the electrode pads (22). Optionally, a step of forming a solder precoat (15) at the connection ends of the center conductors (11) of the plurality of fine electrical wires is provided.
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Inventors:
TANAKA MASATO (JP)
MURAOKA TOSHIKAZU (JP)
NAKATSUGI KYOUICHIROU (JP)
MURAOKA TOSHIKAZU (JP)
NAKATSUGI KYOUICHIROU (JP)
Application Number:
PCT/JP2013/056446
Publication Date:
September 12, 2013
Filing Date:
March 08, 2013
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01R12/51; H01B13/00; H02G1/14
Domestic Patent References:
| WO2008105397A1 | 2008-09-04 |
Foreign References:
| JP2010118318A | 2010-05-27 | |||
| JPH0730243A | 1995-01-31 | |||
| JPH077244A | 1995-01-10 | |||
| JP2008252042A | 2008-10-16 | |||
| JPH0774459A | 1995-03-17 | |||
| JP2010146939A | 2010-07-01 | |||
| JPH0685448A | 1994-03-25 | |||
| JPH0518751U | 1993-03-09 |
Attorney, Agent or Firm:
Shin-Ei Patent Firm, P. C. (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
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Claims: