Title:
METHOD FOR MANUFACTURING CONDUCTIVE FILM, CONDUCTIVE FILM, AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2017/033666
Kind Code:
A1
Abstract:
Provided are: a method for manufacturing a conductive film having a substrate and a conductive layer disposed on the substrate, the method comprising a first step for forming, on the substrate, a precursor layer that contains a metal or a precursor thereof, a water-insoluble polymer X having a cross-linking group, a water-insoluble polymer Y having a reactive group that reacts with the cross-linking group, and a water-soluble polymer Z that is different from the polymer X and the polymer Y, a second step for causing a reaction between the cross-linking group in the water-insoluble polymer X and the reactive group in the water-insoluble polymer Y, and a third step for forming the conductive layer by removing the water-soluble polymer Z; the conductive film; and a touch panel that includes the conductive film.
Inventors:
KATAGIRI KENSUKE (JP)
TAJIRI SHIN (JP)
TAJIRI SHIN (JP)
Application Number:
PCT/JP2016/072275
Publication Date:
March 02, 2017
Filing Date:
July 29, 2016
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01B13/00; B32B27/18; C08J7/043; C08J7/044; C08J7/046; C08K3/08; C08L33/02; C08L39/04; C08L89/00; G03C1/04; G06F3/041; H01B5/14; H01B1/22
Foreign References:
| JP2015100973A | 2015-06-04 | |||
| JP2014112512A | 2014-06-19 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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